APPLICATIONS
- 200mm Planarization Contour CMP head , 200mm Titan I Head , 200mm Titan II Head
- Apply for Silicon, shallow trench isolation (STI), oxide polysilicon, tungsten and copper damascene applications
FEATURES & BENEFITS
- High speed planarizing platens
- CMP Head Stable quality to sustain tool availability
- Superior uniformity & efficiency with low downforce.
- Refurbishment and Spare Parts
- Multi-Zone Pressure Control CMP Head
- WIWNU (Within-Wafer Non-Uniformity)
- Edge Exclusion
- Low Downforce
- Overhaul / Repair
- Second-hand semiconductor equipment
Titan I CMP Head ,Overhaul / Repair ,Used ,
200mm , Titan I , Titan I
The Core of Wafer Planarization: 4 Key Elements of CMP Heads
1. Multi-Zone Pressure Control
Core Objective: Minimize Within-Wafer Non-Uniformity (WIWNU)
- Technical Challenge: Wafers naturally exhibit different polish rates between the center and the edge.
- Hardware Architecture: Internal design features 3 to 5+ independent bladder zones.
- Control Precision: Delivers precise, sub-kPa level differential pressure adjustments.
- Result: Dynamically compensates for global flatness to perfectly control film removal rates.
2. Edge Effect Control
Core Objective: Conquer the 2–3mm Outermost Process Blind Spot
- Technical Challenge: The extreme perimeter is highly prone to stress concentration and fluid turbulence.
- Correction Mechanism: Features highly sensitive, localized pressure correction capabilities.
- Yield Protection: Fine-tunes edge polish rates to prevent over-polishing or under-polishing.
3. Vacuum Chucking & Release Mechanism
Core Objective: Ensure “Zero-Breakage, Zero-Scratch” Wafer Transfer
- Loading Phase: Utilizes vacuum suction to securely hold the wafer during high-speed rotation.
- Unloading Phase: Applies precise pneumatic or hydraulic pressure for fluid blow-off release.
- Safety Defense: Prevents wafers from sticking to the pad, completely eliminating secondary surface scratches.
4. Endpoint Detection (EPD) Integration
Core Objective: Achieve Nanometer-Scale Thickness Control with Real-Time Stop
- Sensor Technology: Deeply integrates optical or electromagnetic (eddy current) sensors.
- Real-Time Monitoring: Penetrates film layers during polishing to measure remaining thickness on the fly.
- Closed-Loop Control: Triggers an instant stop signal the moment the target thickness is reached.
Perfect Precision | 300mm CMP Head Refurbishment & Parts SpecialistPerfect Precision is your premier partner for minimizing CMP Total Cost of Ownership (COO).
200mm ,
Why Choose Perfect Precision
We deliver professional 300mm CMP Head Refurbishment and comprehensive Parts Support. By optimizing 5-Zone pressure control and edge effects, we help you maintain top-tier WIWNU and maximum tool uptime.
200mm , CMP Head ,
Why Choose Our 200mm 5-Zone Contour CMP Head Solutions?Specializing in CMP head overhaul and component development, we provide perfectly engineered for STI, Oxide processes.
Our solutions significantly enhance critical performance metrics:WIWNU Optimization: Ensures exceptional within-wafer and wafer-to-wafer uniformity.Edge Exclusion Control: Minimizes edge-zone defects to boost die yield.Advanced Multi-Zone Control: Full hardware support for precise multi-zone pressure regulation.
Core Services & CapabilitiesComplete Overhaul Services: Comprehensive refurbishment and rigorous testing for REFLEXION CMP 300mm Contour Heads.High-Quality Parts Supply: Reliable, cost-effective second-hand parts and turnkey refurbishment programs.Production Line Stability: Securing 24/7 continuous operation for your semiconductor CMP lines with maximum cost efficiency.Perfect Precision: Empowering your semiconductor manufacturing with leading technology and engineering excellence.
Contour, 5 Zone ,Multi-Zone Pressure Control , Refurbishment and Parts
